Classes:
Class K, Class H, Class E
Qualification Letters:
VQ(VQH-98-0227),VQ(VQH-04-007022),VQ(VQH-99-0196),ELS(ELSH-96-0054),VQ(VQH-05-008978),VQ(VQH-06-010730),VQ(VQH-10-020173),VQ(VQH-13-025883),VQ(VQH-04-006510),VQ(VQH-04-007023),VQ(VQH-06-011795),VQ(VQH-15-028729),VQ(VQH-99-0192),VQ(VQH-05-008727),VQ(VQH-09-017847),VQ(VQH-14-028390),EQ(EQC-93-139),EQ(EQC-91-835),ELS(ELSH-96-0161),EQ(EQC-92-084),VQ(VQH-10-020296),VQH-22-036998
Substrate Fabrication Flows:
BSM8 Appendix C
Substrate Fabrication:
Purchased Ceramic Co-fire; Purchased Direct Bonded Copper on Beryllia; Thick Film on Alumina, 4 Conductor Level(s), Resistors
Assembly Flows:
BSM8 Appendix C
Substrate Attach:
Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach:
Eutectic,Nonconductive Epoxy,Conductive Epoxy
Add-on Elements:
Ceramic Tabs,Unpackaged Die,Chip Capacitors,Chip Resistors,Transformers
Wire Bonding:
Aluminum Ribbon,Gold,Aluminum
Packages:
Metal Package, Peripheral Leads, Seam Weld, 5.30 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Ceramic Package, Pin Grid Array, Seam Weld, 5 Seal Perimeter, 101 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.13 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 3.48 Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 5.38 Seal Perimeter, 32 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 5.30 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Dual-in-line, Seam Weld, 2.53 Seal Perimeter, 24 Leads, Gold Lead Finish