Classes:
Class K, Class H, Class E
Qualification Letters:
EQ(EQM-94-0029),VQ(VQH-10-019960),EQ(EQC-91-408),EQ(EQC-91-807),ELS(ELSH-94-0388),VQ(VQH-10-020180),EQ(EQC-91-838),VQ(VQH-01-0034),VQ(VQH-03-003838),VQ(VQH-08-016688),VQ(VQH-11-022643),VQ(VQH-12-024352),VQ(VQH-13-026659),VQ(VQH-13-026696),VQ(VQH-98-0014)
Substrate Fabrication Flows:
D050015G
Substrate Fabrication:
Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors
Assembly Flows:
D050015G
Substrate Attach:
Nonconductive Epoxy,Solder
Element Attach:
Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements:
Tabs,Encapsulated Hybrid,Unpackaged Die,Chip Capacitors,Chip Resistors
Wire Bonding:
Gold,Aluminum
Packages:
Metal Package, Peripheral Leads, Seam Weld, 8.80 Seal Perimeter, 43 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 4.08 Seal Perimeter, 24 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 2.47 Seal Perimeter, 8 Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Seam Weld, 2.14 Seal Perimeter, 19 Leads, Gold Lead Finish