Classes:
Class K, Class H, Class E
Qualification Letters:
ELS(ELSH-96-0184),,ELS(ELSH-95-0107),ELS(ELSH-96-0186),ELS(ELSH-95-0365),EQ(EQC-90-019),EQ(EQC-92-138),VQ(VQH-97-0016),EQ(EQC-92-070),EQ(EQC-93-508),ELS(ELSH-96-0014),VQ(VQH-96-0211),VQ(VQH-97-0170),VQ(VQH-98-0172),ELS(ELSH-94-0256),EQC-93-457,VQ(VQH-96-0210),VQ(VQH-99-0258),VQ(VQH-00-0079)
Substrate Fabrication Flows:
N/A
Substrate Fabrication:
Purchased Ceramic Co-fire; Purchased Thick Film
Assembly Flows:
035A00001
Substrate Attach:
Nonconductive Epoxy
Element Attach:
Nonconductive Epoxy,Conductive Epoxy
Add-on Elements:
Unpackaged Die,Chip Capacitors,Chip Resistors
Wire Bonding:
Gold
Packages:
Ceramic Co-fire Package, Axial Leads, Seam Weld, 4.58 Seal Perimeter, 66 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Pin Grid Array, Seam Weld, 4.10 Seal Perimeter, 66 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Brazed Leads, Seam Weld, 5.36 Seal Perimeter, 68 Leads, Gold/Solder Lead Finish, Getter Qualified