Qualification Part Search

Company Location Information

Micross Hi-Rel Power Solutions (CAGE Code:52467)
2520 Junction Avenue, San Jose, CA, 95134-1902, US

Company Contact: Mr. Granville 'Bo' Rains,Phone: 408-310-8640,Fax:
Land and Maritime Contact:Phone: 614-692-1766, Fax: 614-693-1658, E-mail: vqh.jms@dla.mil

Quality Management (QM) Program:Non-TRB
Periodic Inspection System:Options 1 and 2
ISO 9000 System:

Technologies:DC/DC Converters

Advanced Semiconductor Engrg Inc, Nantou Branch

Classes: Class K, Class H, Class E

Qualification Letters: VQ(VQH-02-1624),VQ(VQH-05-009379)

Substrate Fabrication Flows:
Substrate Fabrication:

Assembly Flows: 8002-0044
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements: Tabs,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors,Transformers
Wire Bonding: Copper,Gold,Aluminum

Packages: Metal Package, Axial Leads, Seam Weld, 6.58 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish

San Jose Facility

Classes: Class K, Class H, Class E

Qualification Letters: ELS(ELSH-94-0272),EQ(EQC-89-065),VQ(VQH-05-9326),VQ(VQH-06-011051),EQ(EQC-90-652),VQ(VQH-12-023788),EQ(EQC-93-403),VQ(VQH-98-0100),VQ(VQH-08-015552),VQ(VQH-13-026800),ELS(ELSH-94-0211),ELS(ELSH-94-0482),ELS(ELSH-94-0483),VQ(VQH-03-003517),VQ(VQH-14-027974),VQ(VQH-18-033604),EQ(EQC-93-658),ELS(ELSH-94-0173),EQ(EQC-93-553),EQ(EQC-92-103),VQ(VQH-19-033816),VQH-19-034346,VQ(VQH-07-013935),VQ(VQH-14-027466),VQ(VQH-98-0231),VQ(VQH-15-029435),VQ(VQH-18-032741),ELS(ELSH-94-0212),EQ(EQC-93-204),VQH-19-034320,VQH-19-034319,VQH-21-035754

Substrate Fabrication Flows: 8002-0044
Substrate Fabrication: Thick Film on Alumina, 5 Conductor Level(s), Resistors; Thick Film on Beryllia, 4 Conductor Level(s), Resistors; Purchased Direct Bonded Copper

Assembly Flows: 8002-0044
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Nonconductive Epoxy,RTV,Elastomer,Conductive Epoxy,Solder
Add-on Elements: Tabs,Inductors,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors,Wires,Terminals,Transformers
Wire Bonding: Copper,Gold,Aluminum

Packages: Metal Package, Axial Leads, Seam Weld, 6.58 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 10.10 Seal Perimeter, 58 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Dual-in-line, Seam Weld, 3.69 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 11 Seal Perimeter, 13 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Laser Weld, 4.30 Seal Perimeter, 9 Leads, Gold/Solder Lead Finish, Getter Qualified

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.