Classes:
Class H, Class E
Qualification Letters:
VQ(VQH-03-004414),VQ(VQH-04-006128),VQ(VQH-07-012468),VQ(VQH-11-021809),VQ(VQH-11-021880),VQ(VQH-14-028435),VQH-22-036594,VQ(VQH-99-0200),VQ(VQH-02-001187),VQ(VQH-99-0175),VQ(VQH-04-006855),VQ(VQH-20-035363),VQ(VQH-99-0134),VQ(VQH-99-0070),VQ(VQH-06-010206),VQ(VQH-07-012130),VQ(VQH-10-020020),VQ(VQH-11-021213),VQH-19-033616,VQ(VQH-19-034242),VQ(VQH-97-0266),VQ(VQH-11-021879),VQ(VQH-10-019429),VQ(VQH-11-021614),VQ(VQH-20-034966),VQ(VQH-16-030733),VQ(VQH-01-0017),VQ(VQH-01-0060),VQ(VQH-06-011675),VQ(VQH-11-021810),VQ(VQH-16-029837),VQH-19-033939,VQ(VQH-20-035559),VQH-21-035921,VQ(VQH-05-008873),VQ(VQH-10-019428)
Substrate Fabrication Flows:
QA-039
Substrate Fabrication:
Thick Film on Alumina, 3 Conductor Level(s), Resistors; Purchased Direct Bonded Copper
Assembly Flows:
QA-039
Substrate Attach:
Conductive Epoxy,Solder
Element Attach:
Eutectic,Nonconductive Epoxy,Conductive Epoxy,Nonconductive RTV,Solder
Add-on Elements:
Tabs,Inductors,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors,Toroids,Daughter Board
Wire Bonding:
Copper,Gold,Aluminum
Packages:
Metal Package, Axial Leads, Projection Weld, 5.14 Seal Perimeter, 8 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 20 Leads, Gold Lead Finish, Getter Qualified