Classes:
Class K, Class H, Class E
Qualification Letters:
VQ(VQH-98-0253),ELS(ELSH-94-0297),VQ(VQH-04-006128),VQ(VQH-05-008263),VQ(VQH-07-013397),VQ(VQH-13-026724),VQ(VQH-14-028435),EQ(EQC-93-280),VQ(VQH-00-0188),VQ(VQH-07-012467),VQ(VQH-17-031099),VQH-21-035753,ELS(ELSH-95-0036),EQ(EQC-93-196),VQ(VQH-07-012129),VQ(VQH-17-031269),VQH-19-033438,VQ(VQH-16-030645),VQH-26-040192,EQ(EQM-87-2838),EQ(EQC-92-300),EQ(EQC-93-031),EQ(EQM-89-0439),ELS(ELSH-96-0095),VQ(VQH-05-008516),VQH-22-037365,VQ(VQH-96-0214),EQ(EQC-93-550),EQ(EQM-94-043),EQ(EQC-93-056),VQ(VQH-03-003760),VQH-25-039257,VQH-25-039503,ELS(ELSH-95-0375),EQ(EQC-92-174),ELS(ELSH-94-0336),ELS(ELSH-94-0364),VQ(VQH-00-0131),VQ(VQH-03-003336),VQH-19-033160,VQH-19-033393,VQH-22-036664,EQ(EQM-94-0111),VQ(VQH-17-031528),ELS(ELSH-96-0139),VQ(VQH-99-0013),EQC-93-624,EQ(EQC-93-221),VQ(VQH-05-007236 AMENDED),VQ(VQH-05-008820),VQ(VQH-17-030801)
Substrate Fabrication Flows:
QA-039
Substrate Fabrication:
Thick Film on Alumina, 3 Conductor Level(s), Resistors; Purchased Direct Bonded Copper
Assembly Flows:
QA-039
Substrate Attach:
Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach:
Eutectic,Nonconductive Epoxy,RTV,Conductive Epoxy,Solder
Add-on Elements:
Tabs,Inductors,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors,Toroids,Daughter Board
Wire Bonding:
Copper,Gold,Aluminum
Packages:
Metal Package, Axial Leads, Seam Weld, 6 Seal Perimeter, 38 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8.75 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Projection Weld, 4.26 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 32 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.40 Seal Perimeter, 5 Leads, Gold Lead Finish, Getter Qualified