Classes:
Class K, Class H, Class E
Qualification Letters:
VQ(VQH-04-006618),VQH-19-033652,VQH-24-038726,VQH-22-036692,VQ(VQH-97-047),VQ(VQH-00-0109),VQH-24-038727,VQH-21-036527,EQ(EQC-90-0754),EQ(EQC-93-271),VQ(VQH-02-001278),VQH-25-039049,EQ(EQC-93-591),EQ(EQM-88-1265),VQ(VQH-01-0164),VQH-22-037043,VQH-21-036458,EQ(EQM-87-2594),VQ(VQH-18-031820),VQH-24-038217,ELS(ELSH-95-271),VQH-19-033976,VQ(VQH-02-000432),VQ(VQH-04-006839)
Substrate Fabrication Flows:
N/A
Substrate Fabrication:
Purchased Thick Film
Assembly Flows:
ICPI-9001-3
Substrate Attach:
Eutectic,Silver Glass,Solder
Element Attach:
Eutectic,Silver Glass
Add-on Elements:
Unpackaged Die
Wire Bonding:
Gold,Aluminum
Packages:
Ceramic Package, Leadless Chip Carrier, Solder Seal, 0.92 Seal Perimeter, 20 Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Solder Seal, 1.32 Seal Perimeter, 16 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Solder Seal, 1.28 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish