Classes:
Class K, Class H, Class G, Class E
Qualification Letters:
EQ(EQC-92-417),VQ(VQH-04-005148),VQ(VQH-05-008994),VQ(VQH-06-009631),VQ(VQH-06-010086),VQ(VQH-06-010359),VQ(VQH-06-010509),VQ(VQH-11-022826),EQ(EQC-90-507),EQ(EQM-94-084),VQ(VQH-97-0228),VQ(VQH-97-0238),VQ(VQH-97-0089),VQ(VQH-03-002841),VQ(VQH-04-005084),VQ(VQH-04-006941),VQ(VQH-05-008546),VQ(VQH-08-014909),VQ(VQH-11-022828),VQ(VQH-15-028968),VQ(VQH-15-029048),VQH-22-036671,EQ(EQM-94-093),VQ(VQH-00-0023),EQ(EQC-93-141),VQ(VQH-96-0206),VQ(VQH-01-0075),VQ(VQH-03-004194),VQ(VQH-05-008995),VQ(VQH-06-010016),VQ(VQH-06-010082),VQ(VQH-11-023107),VQ(VQH-14-027663),EQ(EQC-90-451),ELS(ELSH-94-0470),ELS(ELSH-96-0073),VQ(VQH-97-0223),EQ(EQC-93-242),ELS(ELSH-95-0304),VQ(VQH-01-0065),VQ(VQH-03-003922),VQ(VQH-04-007098),VQ(VQH-09-018313),VQ(VQH-11-022827),VQ(VQH-20-034863),VQ(VQH-20-034693),EQ(EQC-93-687),ELS(ELSH-96-0086),VQ(VQH-97-0073),VQ(VQH-02-000095),VQ(VQH-04-005646),VQ(VQH-04-007061),VQ(VQH-06-011516),VQ(VQH-07-012278),VQ(VQH-07-012548),VQ(VQH-06-010846),VQ(VQH-09-016693),VQ(VQH-09-018466),VQ(VQH-10-021073),VQ(VQH-11-023234),VQ(VQH-13-026264),EQ(EQC-93-682),ELS(ELSH-94-0400),ELS(ELSH-95-0020),VQ(VQH-05-008816),VQ(VQH-06-009683),VQ(VQH-07-013658),VQ(VQH-09-018310),VQ(VQH-09-018978),VQ(VQH-99-0145),EQ(EQC-93-346),EQ(EQC-93-554),ELS(ELSH-94-0402),VQ(VQH-00-0242),VQ(VQH-03-004192),VQ(VQH-06-009742),VQ(VQH-11-023174),VQ(VQH-13-025668),VQ(VQH-14-027599),VQ(VQH-18-032808),VQH-21-035585,EQ(EQC-93-488),ELS(ELSH-94-0401),ELS(ELSH-95-0216),VQ(VQH-97-0046),VQ(VQH-97-0243),VQ(VQH-98-0246),VQ(VQH-04-006786),VQ(VQH-08-014579),VQ(VQH-12-024146),VQH-22-036908
Substrate Fabrication Flows:
2422-1563
Substrate Fabrication:
Purchased Alumina/Copper; Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s); Thick Film on Alumina, 6 Conductor Level(s); Thick Film on Beryllia, 3 Conductor Level(s), Resistors; Purchased Alumina
Assembly Flows:
2422-1518
Substrate Attach:
Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach:
Eutectic,Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements:
Tabs,Inductors,Ceramic Posts,Unpackaged Die,Chip Capacitors,Chip Resistors,Bonding Block,Daughter Board,Crystal
Wire Bonding:
Gold,Aluminum
Packages:
Metal Package, Platform, Projection Weld, 2.60 Seal Perimeter, 14 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Brazed Leads, Solder Seal, 2.06 Seal Perimeter, 28 Leads, Gold Lead Finish, Getter Qualified; Metal Package, TO Can, Projection Weld, 3.14 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6.95 Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5 Seal Perimeter, 44 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Flatpack, Seam Weld, 5.98 Seal Perimeter, 196 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, LCC, Seam Weld, 2.16 Seal Perimeter, 3 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Flatpack, Solder Seal, 1.33 Seal Perimeter, 14 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Bathtub, Seam Weld, 2.45 Seal Perimeter, 5 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Flatpack, Seam Weld, 2.38 Seal Perimeter, 10 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Surface Mount, Seam Weld, 2.15 Seal Perimeter, 3 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 4.79 Seal Perimeter, 10 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, LCC, Solder Seal, 1.40 Seal Perimeter, 20 Leads, Gold Lead Finish, Getter Qualified