Qualification Part Search

Company Location Information

Data Device Corporation (CAGE Code:19645)
105 Wilbur Place, Bohemia, NY, 11716-2482, US

Company Contact: Ms. Natalia Ramos,Phone: (631) 563-5336 Ext. 7620,Fax: 631-244-8252
Land and Maritime Contact:Phone: 614-692-9549, Fax: 614-693-1658, E-mail: vqh.sk@dla.mil

Quality Management (QM) Program:TRB
Periodic Inspection System:Options 1 and 2
ISO 9000 System:

Technologies:1553 Bus,Power,Data Converters

Bohemia Line

Classes: Class K, Class H, Class D, Class G, Class E

Qualification Letters: EQ(EQC-91-308),ELS(ELSH-95-0140),EQ(EQC-90-657),EQ(EQC-91-104),EQ(EQC-93-199),EQ(EQC-90-220),EQ(EQC-93-599),EQ(EQC-91-306),VQ(VQH-03-3982),VQ(VQH-10-019748),ELS(ELSH-94-0399),VQ(VQH-02-0969),VQ(VQH-06-010110),ELS(ELSH-95-0266),EQ(EQC-91-386),ELS(ELSH-94-0392),VQ(VQH-99-0129),VQ(VQH-04-6876),EQ(EQC-91-606),VQ(VQH-99-0033),VQ(VQH-99-0222),EQ(EQC-93-625),EQ(EQC-91-667),EQ(EQC-93-055),ELS(ELSH-94-0327),VQ(VQH-98-0101),VQ(VQH-96-0203),VQ(VQH-04-5821),VQ(VQH-07-013396)

Substrate Fabrication Flows: 45552
Substrate Fabrication: Thick Film on Beryllia, 1 Conductor Level(s), Resistors; Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s)

Assembly Flows: 41634,41635,45552
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Eutectic,Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements: Tabs,Tantalum Capacitors,Unpackaged Die,Chip Capacitors,Chip Resistors,Ceramic Capacitors,Transformers
Wire Bonding: Copper/Tin Solder,Gold,Aluminum

Packages: Ceramic Package, Peripheral Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 5.80 Seal Perimeter, 70 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.80 Seal Perimeter, 70 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, J-Leads, Solder Seal, 2.12 Seal Perimeter, 40 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8.80 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 10.26 Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 7.58 Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified

sub: API Technologies Corp. RF2M UK (CAGE: U4388)

Classes: Class K, Class H, Class E

Qualification Letters: VQ(VQH-04-007022),VQ(VQH-98-0227),VQ(VQH-99-0196),ELS(ELSH-96-0054),VQ(VQH-13-025883),VQ(VQH-06-010730),VQ(VQH-10-020173),VQ(VQH-05-008978),VQ(VQH-04-007023),VQ(VQH-06-011795),VQ(VQH-04-006510),VQ(VQH-14-028390),VQ(VQH-99-0192),VQ(VQH-09-017847),VQ(VQH-05-008727),EQ(EQC-91-835),EQ(EQC-93-139),ELS(ELSH-96-0161),EQ(EQC-92-084),VQ(VQH-10-020296)

Substrate Fabrication Flows: FCES 6301:15
Substrate Fabrication: Purchased Ceramic Co-fire; Purchased Direct Bonded Copper on Beryllia; Thick Film on Alumina, 4 Conductor Level(s), Resistors

Assembly Flows: FCES 6301:15
Substrate Attach: Nonconductive Epoxy,Conductive Epoxy,Solder
Element Attach: Eutectic,Nonconductive Epoxy,Conductive Epoxy
Add-on Elements: Ceramic Tabs,Chip Capacitors,Unpackaged Die,Chip Resistors,Transformers
Wire Bonding: Aluminum Ribbon,Gold,Aluminum

Packages: Metal Package, Peripheral Leads, Seam Weld, 5.30 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Ceramic Package, Pin Grid Array, Seam Weld, 5 Seal Perimeter, 101 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.13 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 3.48 Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 5.38 Seal Perimeter, 32 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 5.30 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Dual-in-line, Seam Weld, 2.53 Seal Perimeter, 24 Leads, Gold Lead Finish

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for compliant product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.