Marlborough Plant
Classes:
Class K, Class H, Class E
Qualification Letters:
EQ(EQC-92-062),VQ(VQH-99-0204),VQ(VQH-01-0102),ELS(ELSH-94-0254),EQ(EQC-94-008),VQ(VQH-06-010485),VQ(VQH-08-014380),EQ(EQC-91-894),VQ(VQH-01-0104),VQ(VQH-04-004898),VQ(VQH-07-013689),VQ(VQH-99-0176),VQ(VQH-98-0177),VQ(VQH-98-0232),EQ(EQC-93-162),ELS(ELSH-94-0252),ELS(ELSH-95-0269),VQ(VQH-04-005172),VQ(VQH-06-011842),EQ(EQC-91-235),ELS(ELSH-95-0183),EQ(EQC-89-421),EQ(EQM-88-0709),ELS(ELSH-94-0253),VQ(VQH-03-004619)
Substrate Fabrication Flows:
52-0059
Substrate Fabrication:
Thin Film on Beryllia, 1 Conductor Level(s); Ceramic Co-fire; Thin Film on Alumina, 1 Conductor Level(s); Purchased Thick Film on Alumina, 5 Conductor Level(s); Purchased Direct Bonded Copper on Alumina Nitride, 2 Conductor Level(s)
Assembly Flows:
FC-25,12-0902
Substrate Attach:
Nonconductive Epoxy,Solder
Element Attach:
Eutectic,Nonconductive Epoxy,Conductive Epoxy,Solder
Add-on Elements:
Unpackaged Die,Chip Resistors,Chip Capacitors
Wire Bonding:
Gold,Aluminum
Packages:
Copper Package, Single-in-line, Seam Weld, 4.90 Seal Perimeter, 17 Leads, Nickel Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 2.57 Seal Perimeter, 14 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 6.20 Seal Perimeter, 136 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.65 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Seam Weld, 1.62 Seal Perimeter, 28 Leads, Solder Lead Finish; Metal Package, TO can, Projection Weld, 6 Seal Perimeter, 12 Leads, Nickel Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.13 Seal Perimeter, 22 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Single-in-line, Seam Weld, 2.90 Seal Perimeter, 10 Leads, Gold Lead Finish