This is the Final Report for the Engineering Practices (EP) Study of Proposed Changes to MIL-PRF-38535 for Mixed Date Codes and Multiple Date Codes on One (1) Certificate of Conformance.
Dated: 24 June 2008
File name: ep_prf38535h.pdf, File Size: 34 kb
Proposed Changes to MIL-PRF-38535 for Additional Requirements on Test Optimization Data
Dated: 15 October 2008
File name: prf38535EPStudy.pdf, File Size: 16 kb
Proposed Changes to MIL-PRF-38535 for Additional Requirements on Passive Elements.
Dated: 22 February 2010
File name: prf38535PassElmt.pdf, File Size: 21 kb
Proposed Changes to MIL-PRF-38535 Concerning Determination of New Technology Requirements in the Appendix H.
Dated: 02 March 2010
File name: prf38535_EPS_New_Tech.pdf, File Size: 19 kb
Proposed Changes to MIL-PRF-38535 Concerning Addition of Requirements for Internal Gas Analysis As A Process Monitor
Dated: 04 March 2010
File name: prf38535EPStudy_IGA.pdf, File Size: 16 kb
Proposed New Class Y (Non-Hermetic Microcircuits for Space Application) Requirements for MIL-PRF-38535
Dated: 24 February 2012
File name: prf38535EPStudyClassY.pdf, File Size: 284 kb
Final Report: Similar Screening, TCI/QCI and RHA Table Requirements of MIL-PRF-38535 and TM5004/5005 of MIL-STD-883.
Dated: 16 August 2012
File name: prf38535EPStudytables.pdf, File Size: 173 kb
Use of Base Metal Electrode (BME) Capacitors in QML Hybrid Microcircuits.
Dated: 26 September 2012
File name: prf38534EPStudy_BME.pdf, File Size: 19 kb
MIL-STD-883, Method 1014 Survey of Industry to Determine Which Test Conditions Are Being Used
Dated: 20 October 2014
File name: std883tm1014EPStudy.pdf, File Size: 98 kb
Proposed Changes to MIL-PRF-38535 Requirement of Laser Scribing for Die Separation From Wafer.
Dated: 06 November 2014
File name: eps38535laserscribing.pdf, File Size: 52 kb
Engineering Practice (EP) Study for Flip Chip Underfill Test Requirements to TM 5011 and MIL-PRF-38535.
Dated: 13 July 2015
File name: EPSprf38535tm5011.pdf, File Size: 405 kb
Engineering Practice (EP) Study for Standard Microcircuits Drawing (SMD) Burn-in Requirements.
Dated: 01 July 2016
File name: epsprf38535burn-in.pdf, File Size: 38 kb
Flip Chip Underfill and Thermal Interface Materials (TIM) Requirements to Propose Test Method TM 5011 of MIL-STD-883 and MIL-PRF-38353.
Dated: 15 August 2016
File name: epsprf3853final.pdf, File Size: 84 kb
Final Report for Engineering Practice (EP) study for preparation of a new class Y (ceramic non-hermetic flip chip BGA/CGA devices) Standard Microcircuit Drawings (SMD) boilerplate under MIL-PRF-38535.
Dated: 12 June 2017
File name: prf38535ClassYBoiler.pdf, File Size: 276 kb
Engineering Practice (EP) Study on Copper (Cu) wire bond test methodology development for microcircuit, hybrid and semiconductor devices.
Dated: 20 September 2017
File name: prf38535CuWireBond.pdf, File Size: 1172 kb
Re-write Radiation Hardness Assurance (RHA) requirements to Appendix C of MIL-PRF-38535.
Dated: 02 May 2017
File name: epsprf38535appc.pdf, File Size: 273 kb
Engineering Practice (EP) Study on proposed changes for electrostatic discharge (ESD)
requirements to MIL-PRF-38535.
Dated: 01 March 2017
File name: epsprf38535esd.pdf, File Size: 125 kb
High Frequency Microcircuit Devices Burn-in Clock Frequency Requirements Under MIL-PRF-38535.
Dated: 08 February 2018
File name: epsprf38535burnin.pdf, File Size: 103 kb
EP study on update of non-hermetic microcircuits class N (military, terrestrial and avionics
application) and class Y (Space application) to MIL-PRF-38535.
Dated: 23 October 2019
File name: epsprf38535class N_Y.pdf, File Size: 719 kb
Engineering Practice (EP) study for update of non-hermetic microcircuits class N military, avionics & terrestrial (also suitable for small satellite/space program) applications under MIL-PRF-38535.
Dated: 24 August 2020
File name: idepstudy38535.pdf, File Size: 415 kb
Evaluation and test requirements of Pb free bump for flip chip devices under MIL-PRF-38535
Dated: 01 May 2021
File name: epsprf38535pbfree.pdf, File Size: 398 kb
Ep Study of Non-Hermetic Microcircuit Class N Military, Avionics & Terrestrial (Also Suitable for Small Satellite/Space Program) applications under MIL-PRF-38535. (Phase 2
Dated: 05 March 2021
File name: epsprf38535final.pdf, File Size: 484 kb
the Purpose of This Engineering Practice (Ep) Study Is to Obtain Input/Feedback From the Military Services and DLA Land and Maritime concerning the viability of replacing MIL-HDBK-103 Parts I-III with a link to the online SMCR
Dated: 01 July 2022
File name: epshdbk103final.pdf, File Size: 18 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the military services, microcircuit manufacturers, package assembly houses and user communities regarding the allowance of bi-metallic bonds in class V, Y, and P devices under the MIL-PRF-38535 specification.
Dated: 27 March 2025
File name: epsprf38535_Bimetal.pdf, File Size: 200 kb
The purpose of this Engineering Practice (EP) Study is to obtain input/feedback from the microcircuits manufacturers, test laboratories, OEM, users, military services and space community members regarding IGA packaged related test under the MIL-PRF-38535 specification.
Dated: 26 November 2024
File name: prf38535eps_IGA.pdf, File Size: 397 kb
Determining the Potential Improvements to MIL-STD-883-5 Test Method 5011, Evaluation and Acceptance Procedures for Polymeric Materials
Dated: 27 November 2024
File name: epsstd8835011.pdf, File Size: 165 kb